Combination of secondary intention healing and primary closure to reconstruct large facial defects

• Verfasst von: Arif, Nawa [VerfasserIn]
• Verfasst von: Baumann, Lara [VerfasserIn]
• Verfasst von: Felcht, Moritz [VerfasserIn]
• Titel: Combination of secondary intention healing and primary closure to reconstruct large facial defects
• Titelzusatz: minireview
• Verf.angabe: Nawa Arif, Lara Baumann, Moritz Felcht
• E-Jahr: 2024
• Jahr: October 2024
• Umfang: 6 S.
• Illustrationen: Illustrationen
• Fussnoten: Gesehen am 04.11.2024 ; Erstmals online veröffentlicht: 21. August 2024
• Titel Quelle: Enthalten in: Deutsche Dermatologische GesellschaftJournal der Deutschen Dermatologischen Gesellschaft
• Ort Quelle: Berlin : Wiley-Blackwell, 2003
• Jahr Quelle: 2024
• Band/Heft Quelle: 22(2024), 10 vom: Okt., Seite 1344-1349
• ISSN Quelle: 1610-0387
• DOI: doi:10.1111/ddg.15481
• Datenträger: Online-Ressource
• Sprache: eng
• Bibliogr. Hinweis: Parallele Sprachausgabe : deutschArif, Nawa, 1993 - : Kombination aus sekundärer Wundheilung und Dehnungsplastik zur Deckung großer Gesichtsdefekte
• Sach-SW: dermatosurgery
• Sach-SW: primary closure
• Sach-SW: secondary intention healing
• K10plus-PPN: 1907413391

Abstract

Secondary intention healing has been a well-established method to close wounds for more than 200 years. Indeed, it represents the easiest technique in the ladder of plastic reconstruction. Primary wound closure (side-to-side closure, direct wound closure) is the second easiest method. The combination of these two techniques is already an integral aspect of specific surgical procedures, e.g. the reconstruction of the donor site of a paramedian forehead flap. This minireview will show that the combination is also a suitable alternative to classic flaps in reconstruction of different aesthetic subunits of the face. These are the scalp, the lateral cheek, the upper nasal sidewall/medial canthus and the retroauricular region. The advantages and disadvantages will be discussed and illustrated with clinical examples.