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Verfasst von:Wan, Xianglong [VerfasserIn]   i
 Asyuda, Andika [VerfasserIn]   i
 Zharnikov, Michael [VerfasserIn]   i
Titel:Thermal stability of phosphonic acid self-assembled monolayers on alumina substrates
Verf.angabe:Xianglong Wan, Itai Lieberman, Andika Asyuda, Sebastian Resch, Henning Seim, Peer Kirsch, Michael Zharnikov
E-Jahr:2020
Jahr:January 6, 2020
Umfang:12 S.
Fussnoten:Gesehen am 26.02.2020
Titel Quelle:Enthalten in: The journal of physical chemistry <Washington, DC> / C
Ort Quelle:Washington, DC : Soc., 2007
Jahr Quelle:2020
Band/Heft Quelle:124(2020), 4, Seite 2531-2542
ISSN Quelle:1932-7455
Abstract:Thermal stability of several representative self-assembled monolayers (SAMs) with phosphonic acid (PA) anchoring group on Al2O3 substrates was studied by in situ high resolution X-ray photoelectron spectroscopy, complemented by thermogravimetric analysis of the relevant bulk materials and theoretical simulations. The range of thermal stability and the degradation pathways were found to be dependent on the chemical composition of the SAM forming molecules, with backbone-specific “weak links”. Whereas the anchoring groups were hardly affected by annealing up to 773 K (highest temperature applied for most of the samples), temperature-induced breakup of the bond between the backbone and anchoring group or a specific bond within the backbone was observed. The former is the case for nonsubstituted alkyl backbone, which is cleaved at temperatures above 673-773 K (depending on the backbone length), with the subsequent desorption of the released fragments. The latter is the case for the substituted (pentafluorophenoxy) or partly fluorinated alkyl backbone, with the bond cleavage occurring at temperatures above 523 K, either between the substitution and alkyl linker or between the fluorinated and nonfluorinated segments of the backbone. The above results suggest a higher robustness and better thermal stability of PA monolayers as compared to other types of SAMs, such as thiolates on coinage metal substrates. It is however advisible to test thermal stability of a specifically designed, functional PA SAM in context of possible “weak links” as far as this is important for a particular application.
DOI:doi:10.1021/acs.jpcc.9b10628
URL:Bitte beachten Sie: Dies ist ein Bibliographieeintrag. Ein Volltextzugriff für Mitglieder der Universität besteht hier nur, falls für die entsprechende Zeitschrift/den entsprechenden Sammelband ein Abonnement besteht oder es sich um einen OpenAccess-Titel handelt.

Volltext: https://doi.org/10.1021/acs.jpcc.9b10628
 Verlag: https://pubs.acs.org/doi/full/10.1021/acs.jpcc.9b10628
 DOI: https://doi.org/10.1021/acs.jpcc.9b10628
Datenträger:Online-Ressource
Sprache:eng
K10plus-PPN:1691052914
Verknüpfungen:→ Zeitschrift

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