Electronic packaging science and technology

• Verfasst von: Tu, K. N. [VerfasserIn]
• Verfasst von: Chen, Chih [VerfasserIn]
• Verfasst von: Chen, Hung-Ming [VerfasserIn]
• Titel: Electronic packaging science and technology
• Verf.angabe: King-Ning Tu, Chih Chen, Hung-Ming Chen
• Verlagsort: Hoboken, NJ
• Verlag: John Wiley & Sons, Inc.
• Jahr: 2022
• Umfang: 1 online resource
• Fussnoten: Includes bibliographical references and index. - Description based on online resource; title from digital title page (viewed on April 14, 2022)
• ISBN: 978-1-119-41834-4
• ISBN: 1-119-41834-8
• ISBN: 978-1-119-41833-7
• ISBN: 1-119-41833-X
• ISBN: 978-1-119-41832-0
• ISBN: 1-119-41832-1
• ISBN: 978-1-119-41831-3
• Datenträger: Online-Ressource
• Sprache: eng
• Bibliogr. Hinweis: Erscheint auch als : Druck-Ausgabe
• Sach-SW: Mise sous boîtier (Électronique)
• Sach-SW: Electronic packaging
• K10plus-PPN: 1840141646
• K10plus-PPN:
  Universitätsbibliothek
• Lokale URL UB: Zum Volltext
• Lokale URL UB: Bibliothek der Medizinischen Fakultät Mannheim der Universität Heidelberg
• Bibliothek/Idn: UW / m4297432234
• Lokale URL Inst.: Zum Volltext

Abstract

"This book focuses on modern technology and how electronic packaging plays a major role in moving technology forward. With the enhancement of mobile technology and its challenges, the need for packing technology solutions is evident. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology"--